Etched Diamond
¥100.00
- Typical Size Range
- 1 µm - 40 µm
Payment
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Product overview
Introduction
Through specialized surface treatment, nano-scale multi-edge cutting structures are formed on monocrystalline diamond surfaces, enhancing abrasive retention, improving grinding efficiency, and reducing surface scratches on workpieces.
Product benefits
Features
- Multi-edge cutting structure with excellent self-sharpening capability and extended service life.
- Shallow cutting edges and low grinding resistance to reduce workpiece scratching.
- Good heat dissipation performance and high grinding efficiency.
Product data
Specifications
| Model Number | YS/KS |
|---|---|
| Typical Size Range | 1 um - 40 um |
| Sample Size | 5 ct / 50 ct / 100 ct |
| Scope | Fine, medium, and rough polishing. |
Where it is used
Applications
Grinding and polishing of hard and brittle materials such as LED sapphire, silicon carbide wafers, and semiconductor wafers.
Precision polishing where efficient cutting and reduced scratching are required.
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