Agglomerated Diamond
¥100.00
- Primary Particle Size
- 0.1 µm - 1 µm
- Agglomerated Particle Size
- 5 µm - 120 µm
Payment
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Product overview
Introduction
Produced through a specialized granulation process, fine diamond abrasive particles are bonded into independent agglomerated grains using high-strength binders. During grinding, dulled surface particles gradually fracture and detach, continuously exposing fresh abrasive particles.
Product benefits
Features
- Spherical or near-spherical particles with smooth burr-free surfaces to reduce workpiece scratching.
- Multi-edge cutting structure for strong cutting ability and extended service life.
- Uniform porous structure for improved heat dissipation during processing.
Product data
Specifications
| Model Number | YS/GH |
|---|---|
| Primary Particle Size | 0.1 - 1 um |
| Agglomerated Particle Size | 5 - 120 um |
| Note | Particle size can be customized according to actual application requirements. |
Where it is used
Applications
Precision grinding and polishing of LED sapphire, optical crystals, ultra-hard ceramics, and other advanced materials.
Polishing applications requiring high cutting efficiency and improved surface quality.
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