Diamond Slurry & Paste Selection Guide
Application-based selection guide for diamond polishing and precision grinding — covering semiconductor, sapphire, optical glass, ceramic, mold and precision tool applications.
Selection Factors
| Selection Factor | Influence on Performance |
|---|---|
| Material Type | Determines abrasive compatibility and cutting behavior |
| Diamond Particle Size | Controls removal rate and surface finish |
| Diamond Concentration | Affects cutting efficiency and polishing performance |
| Carrier System | Influences lubrication, dispersion and cleaning performance |
| Processing Method | Determines suitable product form |
Why Selection Matters
Different materials and processing requirements call for different diamond abrasive solutions. The performance of diamond slurry and paste depends on:
- ✓ Diamond particle size
- ✓ Diamond concentration
- ✓ Diamond type and crystal structure
- ✓ Carrier system
- ✓ Processing method
- ✓ Surface finish requirements
Yuansu Diamond provides customised diamond slurry and paste solutions. Customers can achieve:
- ✓ Material removal rate
- ✓ Surface finish quality
- ✓ Processing efficiency
- ✓ Cost effectiveness
- ✓ Process stability
Semiconductor Wafer Polishing
Semiconductor Wafer Polishing
Typical materials: silicon wafers, SiC wafers, sapphire substrates, GaN wafers.
Processing requirements: ultra-low surface roughness, minimal scratches, excellent surface uniformity, high process consistency.
| Parameter | Recommendation |
|---|---|
| Diamond Type | Polycrystalline / Monocrystalline Diamond |
| Particle Size | 0.05 – 5 μm |
| Concentration | Low to Medium |
| Carrier System | Water-based slurry |
Key advantages:
- ✓ Narrow particle size distribution
- ✓ Low oversized particle content
- ✓ Reduced risk of surface defects
Typical applications:
- ✓ Semiconductor wafer polishing
- ✓ Advanced material finishing
- ✓ Precision surface processing
Sapphire Polishing
Sapphire Polishing
Typical applications: LED substrates, optical windows, smartphone cover glass, precision optical components.
Processing requirements: high material removal efficiency, low surface damage, excellent edge quality, stable polishing performance.
| Parameter | Recommendation |
|---|---|
| Diamond Type | Monocrystalline Diamond |
| Particle Size | 0.5 – 10 μm |
| Concentration | Medium |
| Carrier System | Water-based / Oil-based |
Key advantages:
- ✓ High cutting efficiency
- ✓ Stable polishing performance
- ✓ Reduced subsurface damage
Typical applications:
- ✓ LED substrate polishing
- ✓ Optical window finishing
- ✓ Smartphone cover glass polishing
Optical Glass Polishing
Optical Glass Polishing
Typical materials: optical lenses, precision optical components, quartz glass, infrared optical materials.
Processing requirements: excellent surface finish, low scratch rate, high polishing uniformity.
| Parameter | Recommendation |
|---|---|
| Diamond Type | Polycrystalline Diamond |
| Particle Size | 0.1 – 3 μm |
| Concentration | Low |
| Carrier System | Water-based |
Key advantages:
- ✓ Smooth polishing performance
- ✓ Excellent dispersion stability
- ✓ Reduced polishing defects
Typical applications:
- ✓ Optical lens polishing
- ✓ Quartz glass polishing
- ✓ Infrared optical material finishing
Ceramic & Hard Material Processing
Ceramic & Hard Material Processing
Typical materials: zirconia, alumina, silicon carbide, advanced ceramics.
Processing requirements: high material removal capability, stable cutting performance, long processing life.
| Parameter | Recommendation |
|---|---|
| Diamond Type | Monocrystalline Diamond |
| Particle Size | 1 – 20 μm |
| Concentration | Medium to High |
| Carrier System | Oil-based / Water-based |
Key advantages:
- ✓ Strong cutting ability
- ✓ High removal efficiency
- ✓ Excellent wear resistance
Typical applications:
- ✓ Zirconia ceramic grinding
- ✓ Alumina ceramic finishing
- ✓ Silicon carbide processing
Mold & Precision Tool Polishing
Mold & Precision Tool Polishing
Typical applications: carbide tools, mold steel, precision mechanical components, tool finishing.
Processing requirements: high surface brightness, fine polishing performance, stable processing results.
| Parameter | Recommendation |
|---|---|
| Diamond Type | Monocrystalline Diamond |
| Particle Size | 0.25 – 5 μm |
| Concentration | Medium |
| Carrier System | Oil-based paste |
Key advantages:
- ✓ Fast polishing performance
- ✓ Excellent surface brightness
- ✓ Easy cleaning after polishing
Typical applications:
- ✓ Carbide tool polishing
- ✓ Mold steel finishing
- ✓ Precision mechanical component polishing
Particle Size Guide
Particle size directly affects polishing performance.
| Particle Size | Processing Characteristics | Typical Applications |
|---|---|---|
| 50–100 nm | Ultra-fine finishing | CMP, semiconductor polishing |
| 0.1–0.5 μm | High precision finishing | Optical components, wafers |
| 0.5–3 μm | Balance between efficiency and finish | Sapphire, ceramics |
| 3–10 μm | General precision polishing | Precision machining |
| Above 10 μm | High removal efficiency | Grinding and rough polishing |
Concentration Guide
Diamond concentration directly affects cutting efficiency, polishing speed, surface quality and processing cost.
| Concentration Level | Characteristics | Suitable Applications |
|---|---|---|
| Low Concentration | Better surface finish, lower aggressiveness | Ultra-precision polishing |
| Medium Concentration | Balance between efficiency and quality | General polishing |
| High Concentration | Higher removal rate and stronger cutting | Fast grinding and material removal |
Selection by Outcome
| If your priority is… | Recommended | Suitable Applications |
|---|---|---|
| High Material Removal | ✓ Larger diamond particles ✓ Medium-to-high concentration ✓ Strong cutting diamond type |
Hard material grinding, tool processing, high-efficiency machining |
| High Surface Quality | ✓ Smaller particle size ✓ Narrow particle distribution ✓ Low oversized particle content |
Semiconductor wafers, sapphire substrates, optical components |
| Ultra-Precision Polishing | ✓ Nano or sub-micron diamond particles ✓ Highly controlled particle distribution ✓ Low-defect formulation |
CMP polishing, precision optics, advanced ceramics |
Customised Solutions
Yuansu Diamond provides:
| Customisation | Description |
|---|---|
| ✓ Customized particle size | Matched to your application needs |
| ✓ Customized concentration | Optimised for material removal vs surface finish |
| ✓ Customized carrier system | Water-based, oil-based or paste |
| ✓ Optimized particle distribution | Tight PSD for stable processing |
Request an application recommendation
Tell us your material, processing method and surface finish target — our technical team will help select suitable diamond particle size, concentration level and carrier formulation from the Yuansu Diamond range.