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How to Read a Diamond Powder Particle Size Report

Particle Size Distribution (PSD) is one of the most important quality parameters used to evaluate diamond abrasive performance. This page explains the meaning of D10, D50, D90 and D100, plus how to read a PSD report end-to-end.

Diamond Powder Particle Size Report
Reading a Diamond Powder Particle Size Distribution (PSD) Report

What Is PSD?

Particle Size Distribution (PSD) describes the particle size range and the percentage distribution of different particle sizes within diamond powder.

Since diamond powder undergoes crushing, shaping, purification and classification, particles are not exactly the same size — they are distributed within a controlled particle size range.

PSD provides comprehensive information about:

  • Particle size range
  • Distribution uniformity
  • Ratio of fine and coarse particles
  • Batch-to-batch consistency

PSD directly affects diamond abrasive performance:

  • Material Removal Rate (MRR)
  • Cutting performance
  • Surface finish
  • Process stability
  • Processing yield

D10 / D50 / D90 / D100

D-values represent characteristic particle diameters at specific cumulative distribution percentages.

ParameterDefinition
D1010% cumulative particle size — fine particle indicator
D5050% cumulative particle size (median particle size)
D9090% cumulative particle size — coarse particle control
D100Maximum detected particle size

Generally: D10 indicates fine particle content, D50 is the primary working particle size, D90 reflects coarse particle control, and D100 indicates the maximum detected particle size.

Example: if D50 = 5 μm, then 50% of the diamond particles are smaller than 5 μm and the remaining 50% are larger than 5 μm.

D10 — Fine Particle Control

D10 = 1 μm means ~10% of particles are smaller than 1 μm. D10 mainly reflects ultra-fine particle content and classification control capability.

A well-controlled D10 value helps improve:

  • Reduce processing fluctuations
  • Improve surface finishing consistency
  • Enhance precision machining stability

Typical applications: optical glass polishing, semiconductor wafer processing, sapphire precision grinding, ultra-precision polishing.

D50 — Median Particle Size

D50 is usually the most important reference parameter when selecting diamond powder. It determines grinding efficiency, cutting ability and material removal rate.

D50 RangeCharacteristicsTypical Applications
Larger D50 Higher cutting performance
Higher material removal rate
Faster processing speed
Rough grinding, high-efficiency lapping, diamond tool manufacturing
Smaller D50 Lower surface roughness
Higher processing precision
Better surface finish
Precision polishing, optical component processing, semiconductor applications

D90 — Coarse Particle Control

D90 = 8 μm means 90% of particles are smaller than 8 μm. D90 reflects coarse particle content, oversized particle control capability and distribution width.

Good D90 control helps:

  • Reduce the risk of deep scratches
  • Improve processing consistency
  • Increase product yield

Especially important for: semiconductor wafer polishing, sapphire processing, optical component finishing, precision ceramics.

D100 — Maximum Detected Size

D100 = 12 μm means the maximum detected particle size in the sample is ~12 μm. D100 evaluates oversized particle control, classification process capability and potential scratch risk.

Strict D100 control for high-end precision polishing helps:

  • Minimize abnormal scratches
  • Improve processing reliability
  • Ensure batch-to-batch stability

Distribution Span

Span = (D90 − D10) / D50 — a smaller span means a narrower distribution, better classification accuracy and more consistent processing performance.

SampleD10D50D90SpanInterpretation
Sample A 2 μm 5 μm 8 μm 1.2 Concentrated distribution — consistent processing
Sample B 1 μm 5 μm 15 μm 2.8 Broad distribution — less consistent

Example Report

ParameterResultDescription
D102.1 μmFine particle content
D505.0 μmMain working particle size
D907.8 μmCoarse particle control range
D10010.5 μmMaximum detected particle size

This distribution indicates:

  • Controlled particle size range
  • Good particle uniformity
  • Stable grinding performance
  • Suitable for precision grinding and polishing applications

Influence of Particle Size on Performance

Particle Size RangeMain CharacteristicsTypical Applications
Coarse particlesStrong cutting ability, high removal rateRough grinding, grinding tools
Medium particlesBalance between efficiency and surface qualityLapping, precision machining
Fine particlesExcellent surface finishPrecision polishing
Nano particlesUltra-fine finishing capabilityCMP and advanced polishing

Common Measurement Methods

Three widely used techniques for characterising diamond powder particle size.

MethodFeatures
Laser Diffraction Analysis Fast measurement speed
Excellent repeatability
Suitable for production quality control
Dynamic Image Analysis Measures particle size and morphology simultaneously
Suitable for advanced powder evaluation
Scanning Electron Microscopy (SEM) Direct observation of particle morphology
Suitable for R&D analysis and quality verification

Yuansu Diamond Quality Documentation

To help customers fully evaluate product performance, Yuansu Diamond provides professional quality documentation.

DocumentPurpose
Particle Size Distribution Report (PSD Report)Batch particle size data & distribution
Technical Data Sheet (TDS)Product specifications & recommended applications
Safety Data Sheet (SDS)Handling, storage & safety information
Quality Inspection ReportBatch quality inspection results

Quality Inspection Report — based on different application requirements, Yuansu Diamond can provide:

  • Customized particle size grades
  • Tailored particle size distribution solutions
  • Application-specific technical support

Need help interpreting a PSD report?

Share your test data, processing target and surface finish requirement — our technical team can help review particle size distribution and recommend a suitable grade from the Yuansu Diamond range.

Contact our technical team

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